Can the solution be used as a barrier layer between copper and gold to increase gold plating durability?
Umicore Rhoduna® Platinum One Rhodium Platinum Plating Solution 0.3g Rhodium 0.7g Pt/250ml, UN3264Electroplating
Yes, Umicore Rhoduna® Platinum One Rhodium Platinum Plating Solution can be used as a barrier layer between copper and gold to increase gold plating durability.